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High performing AgNW transparent conducting electrodes with a sheet resistance of 2.5 Ω Sq−1 based upon a roll-to-roll compatible post-processing technique
Kumar, Dinesh Stoichkov, Vasil Brousseau, Emmanuel Smith, Graham C. Kettle, Jeff
Kumar, Dinesh
Stoichkov, Vasil
Brousseau, Emmanuel
Smith, Graham C.
Kettle, Jeff
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Other Contributors
EPub Date
Publication Date
2019-02-12
Submitted Date
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Abstract
The report of transparent and conducting silver nanowires (AgNWs) that produce remarkable electrical performance, surface planarity and environmental stability is given. This research presents an innovative process that relies on three sequential steps, which are roll-to-roll (R2R) compatible; thermal embossing, infrared sintering and plasma treatment. This process leads to the demonstration of a conductive film with a sheet resistance of 2.5Ω/sq and high transmittance, thus demonstrating the highest reported figure-of-merit in AgNWs to date (FoM = 933). A further benefit of the process is that the surface roughness is substantially reduced compared to traditional AgNW processing techniques. Finally, consideration of the long-term stability is given by developing an accelerated life test process that simultaneously stresses the applied bias and temperature. Regression line fitting shows that a ∼150-times improvement in stability is achieved at ‘normal operational conditions’ when compared to traditionally deposited AgNW films. X-ray photoelectron spectroscopy (XPS) is used to understand the root cause of the improvement in long-term stability, which is related to reduced chemcial changes in the AgNWs.
Citation
Kumar, D., Stoichkov, V., Broussea, E., Smith, G. C., & Kettle, J. (2019). High performing AgNWs transparent conducting electrodes with 2.5Ω/Sq based upon Roll-to-Roll compatible post processing technique. Nanoscale, 11(12), 5771-5771. http://doi.org/10.1039/C8NR07974A
Publisher
Royal Society of Chemistry
Journal
Nanoscale
Research Unit
DOI
10.1039/c8nr07974a
PubMed ID
PubMed Central ID
Type
Article
Language
en
Description
Series/Report no.
ISSN
2040-3364
EISSN
2040-3372