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Quality Mapping of Offset Lithographic Printed Antenna Substrates and Electrodes by Millimeter-Wave Imaging
Zhang, Jiao Tang, Jianhua Sun, Wenfeng Zhang, Yan Yang, Bin Wang, Xinke
Zhang, Jiao
Tang, Jianhua
Sun, Wenfeng
Zhang, Yan
Yang, Bin
Wang, Xinke
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Publication Date
2019-06-14
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Abstract
Offset lithographic printed flexible antenna substrate boards and electrodes have attracted much attention recently due to the boost of flexible electronics. Unmanned quality inspection of these printed substrate boards and electrodes demands high-speed, large-scale and nondestructive methods, which is highly desired for manufacturing industries. The work here demonstrates two kinds of millimeter (mm)-wave imaging technologies for the quality (surface uniformity and functionality parameters) inspection of printed silver substrates and electrodes on paper and thin polyethylene film, respectively. One technology is a mm-wave line scanner system and the other is a terahertz-time domain spectroscopy-based charge-coupled device (CCD) imaging system. The former shows the ability of detecting transmitted mm-wave amplitude signals only; its detection is fast in a second time scale and the system shows great potential for the inspection of large-area printed surface uniformity. The latter technology achieves high spatial resolution images of up to hundreds of micrometers at the cost of increased inspection time, in a time scale of tens of seconds. With the exception of absorption rate information, the latter technology offers additional phase information, which can be used to work out 2D permittivity distribution. Moreover, its uniformity is vital for the antenna performance. Additionally, the results demonstrate that compression rolling treatment significantly improves the uniformity of printed silver surfaces and enhances the substrate’s permittivity values.
Citation
Zhang, J., Tang, J., Sun, W., Zhang, Y., Wang, X. & Yang, B. (2019). Quality Mapping of Offset Lithographic Printed Antenna Substrates and Electrodes by Millimeter-Wave Imaging. Electronics, 8(6), 674.
Publisher
MDPI
Journal
Electronics
Research Unit
DOI
10.3390/electronics8060674
PubMed ID
PubMed Central ID
Type
Article
Language
en
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Series/Report no.
ISSN
EISSN
2079-9292