Loading...
LevelEd SR: A Substitutional Reality Level Design Workflow
Beever, Lee John, Nigel W.
Beever, Lee
John, Nigel W.
Advisors
Editors
Other Contributors
Affiliation
EPub Date
Publication Date
2022-04-20
Submitted Date
Collections
Other Titles
Abstract
Virtual reality (VR) and augmented reality (AR) have continued to increase in popularity over the past decade. However, there are still issues with how much space is required for room-scale VR and experiences are still lacking from haptic feedback. We present LevelEd SR, a substitutional reality level design workflow that combines AR and VR systems and is built for consumer devices. The system enables passive haptics through the inclusion of physical objects from within a space into a virtual world. A validation study (17 participants) has produced quantitative data that suggests players benefit from passive haptics in entertainment VR games with an improved game experience and increased levels of presence. Including objects, such as real-world furniture that is paired with a digital proxy in the virtual world, also opens up more spaces to be used for room-scale VR. We evaluated the workflow and found that participants were accepting of the system, rating it positively using the System Usability Scale questionnaire and would want to use it again to experience substitutional reality.
Citation
Beever, L., & John, N. W. (2022). LevelEd SR: A substitutional reality level design workflow. In 2022 IEEE Virtual Reality and 3D User Interfaces (VR) (130-138). IEEE
Publisher
IEEE
Journal
Research Unit
DOI
10.1109/VR51125.2022.00031
PubMed ID
PubMed Central ID
Type
Conference Contribution
Language
Description
“© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.”
Series/Report no.
ISSN
EISSN
ISBN
9781665496186